document number: 94109 for technical ques tions, contact: diodes-tech@vishay.com www.vishay.com revision: 08-jul-08 1 surface mountable fast soft recovery diode, 8 a 8ewf..spbf soft recovery series vishay high power products features/description the 8ewf..spbf fast soft recovery rectifier series has been optimized for combined short reverse recovery time, low forward voltage drop and low leakage current. the glass passivation ensures stable reliable operation in the most severe temperature and power cycling conditions. this series is designed and qualified for industrial level and lead (pb)-free. applications ? output rectification and free wheeling diode in inverters, choppers and converters ? input rectifications where se vere restrictions on conducted emi should be met product summary v f at 8 a < 1.3 v t rr 80 ns v rrm 1000/1200 v base common cathode + 3 anode 2 1 anode -- d-pak a v aila b le rohs* compliant major ratings and characteristics symbol characteristics values units i f(av) sinusoidal waveform 8 a v rrm 1000/1200 v i fsm 170 a v f 8 a, t j = 25 c 1.3 v t rr 1 a, 100 a/s 80 ns t j range - 40 to 150 c voltage ratings part number v rrm , maximum peak reverse voltage v v rsm , maximum non-repetitive peak reverse voltage v i rrm at 150 c ma 8ewf10spbf 1000 1100 4 8ewf12spbf 1200 1300 absolute maximum ratings parameter symbol test conditions values units maximum average forward current i f(av) t c = 94 c, 180 conduction half sine wave 8 a maximum peak one cycle non-repetitive surge current i fsm 10 ms sine pulse, rated v rrm applied 170 10 ms sine pulse, no voltage reapplied 200 maximum i 2 t for fusing i 2 t 10 ms sine pulse, rated v rrm applied 144 a 2 s 10 ms sine pulse, no voltage reapplied 200 maximum i 2 t for fusing i 2 t t = 0.1 to 10 ms, no voltage reapplied 2000 a 2 s * pb containing terminations are not rohs compliant, exemptions may apply
www.vishay.com for technical questi ons, contact: diodes-tech@vishay.com document number: 94109 2 revision: 08-jul-08 8ewf..spbf soft recovery series vishay high power products surface mountable fast soft recovery diode, 8 a note (1) when mounted on 1" square (650 mm 2 ) pcb of fr-4 or g-10 materi al 4 oz. (140 m) copper 40 c/w for recommended footprint and soldering techniques refer to application note #an-994 electrical specifications parameter symbol test conditions values units maximum forward voltage drop v fm 8 a, t j = 25 c 1.3 v forward slope resistance r t t j = 150 c 25.6 m threshold voltage v f(to) 0.93 v maximum reverse leakage current i rm t j = 25 c v r = rated v rrm 0.1 ma t j = 150 c 4 recovery characteristics parameter symbol test conditions values units reverse recovery time t rr i f at 8 apk 25 a/s t j = 25 c 270 ns reverse recovery current i rr 4.2 a reverse recovery charge q rr 1c snap factor s 0.6 i fm t rr di dt i rr q rr t t a t b thermal - mechanical specifications parameter symbol test conditions values units maximum junction and storage temperature range t j , t stg - 40 to 150 c maximum thermal resistance, junction to case r thjc dc operation 2.5 c/w typical thermal resistance, junction to ambient (pcb mount) r thja (1) 50 soldering temperature t s for 10 seconds 240 c approximate weight 1g 0.03 oz. marking device case style d-pak (to-252aa) 8ewf12s
document number: 94109 for technical ques tions, contact: diodes-tech@vishay.com www.vishay.com revision: 08-jul-08 3 8ewf..spbf soft recovery series surface mountable fast soft recovery diode, 8 a vishay high power products fig. 1 - current rating characteristics fig. 2 - current rating characteristics fig. 3 - forward power loss characteristics fig. 4 - forward power loss characteristics fig. 5 - maximum non-repetitive surge current fig. 6 - maximum non-repetitive surge current 150 0 maximum allowable case temperature (c) average forward current (a) 1 8 0 29 110 130 90 3 5 140 4 60 7 8 e w f.. s series r thjc (dc) = 2.5 c/ w cond u ction angle 30 60 90 120 1 8 0 8 6 70 100 120 ? 150 04 maximum allowable case temperature (c) average forward current (a) 8 110 14 120 2 130 140 100 60 6 8 e w f..s series r thjc (dc) = 2.5 c/ w ? cond u ction period 30 60 90 120 1 8 0 dc 70 8 0 90 12 10 2 0 12 0 maximum average forward power loss (w) average forward current (a) 5 6 9 23 1 4 7 4 8 10 1 8 0 120 90 60 30 cond u ction angle 8 e w f..s series t j = 150 c rms limit 8 6 ? 0 1 8 0 maximum average forward power loss (w) average forward current (a) 10 14 2 6 14 2 6 16 12 8 4 1 8 0 120 90 60 30 dc ? cond u ction period 8 e w f..s series t j = 150 c rms limit 12 10 8 4 1 8 0 1 10 100 peak half sine wave forward current (a) number of equal amplitude half cycle current pulses (n) 120 8 0 100 140 160 150 90 110 130 170 at any rated load condition and w ith rated v rrm applied follo w ing s u rge. initial t j = 150 c at 60 hz 0.00 8 3 s at 50 hz 0.0100 s 8 e w f..s series 90 0.01 0.1 peak half sine wave forward current (a) pulse train duration (s) 140 8 0 100 110 170 200 1 160 1 8 0 8 e w f..s series maxim u m non-repetiti v e s u rge c u rrent v ers u s p u lse train d u ration. initial t j = 150 c n o v oltage reapplied rated v rrm reapplied 120 130 150 190
www.vishay.com for technical questi ons, contact: diodes-tech@vishay.com document number: 94109 4 revision: 08-jul-08 8ewf..spbf soft recovery series vishay high power products surface mountable fast soft recovery diode, 8 a fig. 7 - forward voltage drop characteristics fig. 8 - recovery time characteristics, t j = 25 c fig. 9 - recovery time characteristics, t j = 150 c fig. 10 - recovery charge characteristics, t j = 25 c fig. 11 - recovery charge characteristics, t j = 150 c fig. 12 - recovery current characteristics, t j = 25 c 1000 10 1 1.5 3.5 instantaneous forward current (a) instantaneous forward voltage (v) 100 4.0 1.0 2.5 0.5 2.0 3.0 8 e w f..s series t j = 25 c t j = 150 c 4.5 0.6 0 40 120 200 t rr - maximum reverse recovery time (s) di/dt - rate of fall of forward current (a/s) 0.2 160 0.4 0 8 0 8 e w f..s series t j = 25 c i fm = 10 a i fm = 1 a i fm = 5 a i fm = 2 a i fm = 8 a 0.1 0.3 0.5 0 0 8 0 120 160 200 t rr - maximum reverse recovery time (s) di/dt - rate of fall of forward current (a/s) 0.4 0.6 0.2 0. 8 40 8 e w f..s series t j = 150 c i fm = 10 a i fm = 1 a i fm = 5 a i fm = 2 a i fm = 8 a 0 0 8 0 120 200 q rr - maximum reverse recovery charge (c) di/dt - rate of fall of forward current (a/s) 1.2 0.4 0. 8 2.0 160 40 8 e w f..s series t j = 25 c i fm = 10 a i fm = 8 a i fm = 5 a i fm = 2 a i fm = 1 a 1.6 0 40 200 q rr - maximum reverse recovery charge (c) di/dt - rate of fall of forward current (a/s) 1 2 3 4 5 8 0 120 8 e w f..s series t j = 150 c i fm = 10 a i fm = 8 a i fm = 5 a i fm = 2 a i fm = 1 a 0 160 20 0 0 8 0 120 160 200 i rr - maximum reverse recovery current (a) di/dt - rate of fall of forward current (a/s) 8 16 4 12 40 8 e w f..s series t j = 25 c i fm = 10 a i fm = 8 a i fm = 5 a i fm = 2 a i fm = 1 a
document number: 94109 for technical ques tions, contact: diodes-tech@vishay.com www.vishay.com revision: 08-jul-08 5 8ewf..spbf soft recovery series surface mountable fast soft recovery diode, 8 a vishay high power products fig. 13 - recovery current characteristics, t j = 150 c fig. 14 - thermal impedance z thjc characteristics 25 10 0 0 8 0 200 i rr - maximum reverse recovery current (a) di/dt - rate of fall of forward current (a/s) 20 5 15 40 120 160 8 e w f..s series t j = 150 c i fm = 10 a i fm = 8 a i fm = 5 a i fm = 2 a i fm = 1 a 0.1 0.0001 0.001 0.01 0.1 square wave pulse duration (s) z thjc - transient thermal impedance (c/w) 1 10 1 steady state v al u e (dc operation) 8 e w f..s series single p u lse d = 0.50 d = 0.33 d = 0.25 d = 0.17 d = 0.0 8
www.vishay.com for technical questi ons, contact: diodes-tech@vishay.com document number: 94109 6 revision: 08-jul-08 8ewf..spbf soft recovery series vishay high power products surface mountable fast soft recovery diode, 8 a ordering information table 1 - current rating (8 = 8 a) 2 - circuit configuration: e = single diode 3 - package: w = d-pak 4 - type of silicon: f = fast soft recovery rectifier 5 - voltage code x 100 = v rrm 6 - s = surface mountable 7 - tr = tape and reel trr = tape and reel (right oriented) trl = tape and reel (left oriented) 8 - none = standard production pbf = lead (pb)-free 10 = 1000 v 12 = 1200 v device code 5 13 24 678 8 e w f 12 s tr pbf links to related documents dimensions http://www.vishay.com/doc?95016 part marking information http://www.vishay.com/doc?95059 packaging information http://www.vishay.com/doc?95033
document number: 95016 for technical questions concer ning discrete products, cont act: diodes-tech@vishay.com www.vishay.com revision: 04-nov-08 for technical qu estions concerning module products , contact: ind-modules@vishay.com 1 d-pak (to-252aa) outline dimensions vishay high power products notes (1) dimensioning and toleranci ng as per asme y14.5m-1994 (2) lead dimension uncontrolled in l5 (3) dimension d1, e1, l3 and b3 establish a mi nimum mounting surface for thermal pad (4) section c - c dimension apply to the flat section of the lead between 0.13 and 0.25 mm (0.005 and 0.10") from the lead tip (5) dimension d, and e do not include mold flash. mold flash shall not exceed 0.127 mm (0. 005") per side. these dimensions are meas ured at the outermost extremes of the plastic body (6) dimension b1 and c1 applied to base metal only (7) datum a and b to be determined at datum plane h (8) outline conforms to jedec outline to-252aa dimensions in millimeters and inches symbol millimeters inches notes symbol millimeters inches notes min. max. min. max. min. max. min. max. a 2.18 2.39 0.086 0.094 e 2.29 bsc 0.090 bsc a1 - 0.13 - 0.005 h 9.40 10.41 0.370 0.410 b 0.64 0.89 0.025 0.035 l 1.40 1.78 0.055 0.070 b2 0.76 1.14 0.030 0.045 l1 2.74 bsc 0.108 ref. b3 4.95 5.46 0.195 0.215 3 l2 0.51 bsc 0.020 bsc c 0.46 0.61 0.018 0.024 l3 0.89 1.27 0.035 0.050 3 c2 0.46 0.89 0.018 0.035 l4 - 1.02 - 0.040 d 5.97 6.22 0.235 0.245 5 l5 1.14 1.52 0.045 0.060 2 d1 5.21 - 0.205 - 3 ? 0 10 0 10 e 6.35 6.73 0.250 0.265 5 ?1 0 15 0 15 e1 4.32 - 0.170 - 3 ?2 25 35 25 35 ? 1 e (5) b 3 (3) 0.010 cab l3 (3) b a c h c l2 d (5) l4 b 2 x e b 2 (2) l5 1 2 3 4 ? 2 a c2 a a h seating plane c detail ?c? (7) seating plane a1 detail ?c? rotated 90 cw scale: 20:1 (l1) c c l ? ga u ge plane lead tip m 0.010 cab m 32 4 1 e1 d1 mi n . 0.265 (6.74) mi n . 0.245 (6.23) mi n . 0.0 8 9 (2.2 8 ) mi n . 0.06 (1.524) 0.4 88 (12.40) 0.409 (10.40) 0.093 (2.3 8 ) 0.0 8 5 (2.1 8 ) pad layout
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